Physcial Design - Introduction to PCB Design

Introduction

The creation of a Printed Circuit Board (PCB) involves a multi-step procedure, which encompasses aspects like stackup specification, layer identification, component routing, and the final step of generating files that will be used for fabrication.

For more detailed PCB Designs inluding example stackups from PCB, Flexible PCB, and Rigit PCBs, please visit following page:

• PCB Manufacturing 

Glossary

• PCB (Printed Circuit Board): The board on which electrical components are mounted and connected.

• Stackup: A blueprint that outlines the specifications for the PCB's substrate. This includes information on layers, materials, and other parameters.

Sections Overview

The process can be broadly divided into four main steps:

1. Stackup

• Objective: Determine the foundational elements of the PCB.

• Key Elements:

  • Technology used in PCB

  • Number of layers

  • Material composition

  • Vias (vertical interconnections)

  • Thickness of the board

• Layers Definition

• Objective: Specify the function of each layer.

• Key Layers:

  • Signal layers: Where the electrical signals flow

  • Ground layers: Provide the common ground for the circuit

  • Power layers: Distribute power to the components

2. Floor Planning and Component Placement

• Objective: Decide where each component will reside on the board.

3. Routing

• Objective: Create paths for electrical signals to move from one component to another.

4. Fabrication

• Objective: Produce a fabrication drawing which serves as the blueprint for manufacturing the PCB.

Summary

In summary, board layout is the meticulous process of designing a PCB. It begins with defining the stackup and ends with creating fabrication drawings, ensuring that the board is ready for manufacturing.