Reliability Thermal Test
Thermal reliability ensures electronic products or equipment operate under a wide range of temperature conditions without affecting user experience.
- Thermal Throttling happens when CPU temperature governor starts to downscale CPU frequency or wireless power amplification to limit over all system power output.
- Proper thermal design has NO thermal throttling under any practical system load conditions.
- Product plastic or metal skin temperature Must be under maximum allowed temperature under worst thermal load conditions
- Note: There is a safety regulatory limit to ensure product safety; however product designers should have more stringent limits to improve product competitiveness.
- Define power budget for each high power output components such as processor and and wireless chips and amplifiers
- Use heat sinks on large ICs such as processor.
- Use thermal interference materials (TIM) to pull heat from IC to the surface effectively
- Common TIM: thermal pad, thermal glues, graphite sheet, and thermal pipe.
- Connect component ground pads to the main ground planes to increase thermal relief areas.
Summary & Conclusion
- Thermal reliability ensures product operate under a wide range of temperature and humidity under any thermal load conditions.
- Electronic product surface temperature Must under a safety limit
- Electronic product performance Must not thermal throttle to affect user experience.
- Develop a power budget is essential to understanding and limit thermal hot areas within a PCB board
- Use thermal interference materials (TIMS) to pull heat out of product to ambient air more effectly
Thermal design is critical to product long term operability and user experience .